2009 

Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins
E. W. Qin, L. Lu, N. R. Tao, K. Lu
Scripta Materialia, 60 (2009) 539-542.

Size dependence of rate-controlling deformation mechanisms in nanotwinned copper
L. Lu, M. Dao, T. Zhu, J. Li
Scripta Materialia, 60 (2009) 1062-1066.

Revealing the Maximum Strength in Nanotwinned Copper
L. Lu, X. Chen, X. Huang, K. Lu
Science, 323 (2009) 607-610.  Full Text

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
K. Lu, L. Lu, S. Suresh
Science, 324 (2009) 349-352.  Full Text

Stress relaxation and the structure size-dependence of plastic deformation in nanotwinned copper
L. Lu, T. Zhu, Y. Shen, M. Dao, K. Lu, S. Suresh
Acta Materialia, 57 (2009) 5165-5173.

Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles
E. W. Qin, L. Lu, N. R. Tao, J. Tan, K. Lu
Acta Materialia, 57 (2009) 6215-6225.

孪晶片层厚度对纳米孪晶Cu疲劳性能的影响
卢磊, 唐恋
金属学报, 45 (2009) 808-814.

 2008 

High tensile strength reliability in a bulk metallic glass
J. H. Yao, J. Q. Wang, L. Lu, Y. Li
Applied Physics Letters, 92 (2008) 041905-041903.

Current Progress of Mechanical Properties of Metals with Nano-scale Twins
L. Lu
Journal of Materials Sciences and Technology, 24 (2008) 473-482.

The Effect of Twin Plane Spacing on the Deformation of Copper Containing a High Density of Growth Twins
Z. W. Shan, L. Lu, A. M. Minor, E. A. Stach, S. X. Mao
JOM, 60 (2008) 71-74.

 2007 

Toward a quantitative understanding of mechanical behavior of nanocrystalline metals
M. Dao, L. Lu, R. J. Asaro, J.T.M. De Hosson, E. Ma
Acta Materialia, 55 (2007) 4041-4065.

Work hardening of ultrafine-grained copper with nanoscale twins
X. H. Chen, L. Lu
Scripta Materialia, 57 (2007) 133-136.

Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
X. H. Chen, L. Lu, K. Lu
Journal of Applied Physics, 102 (2007) 083708-083708.

 2006 

亚微米晶铜中孪晶对位错储存能力的影响
郭金宇, 卢秋虹, 卢磊
金属学报, 42 (2006) 903-908.

Dry sliding tribological behavior of nanocrystalline and conventional polycrystalline copper
Z. Han, L. Lu, K. Lu
Tribology Letters, 21 (2006) 47-52.

Lithium fluoride nanowires via vapor-liquid-solid growth
C. B. Jiang, B. Wu, Z. Q. Zhang, L. Lu, S. X. Li, S. X. Mao
Applied Physics Letters, 88 (2006) 093-103.

Tensile Properties of Cu with Deformation Twins Induced by SMAT
J. Guo, K. Wang, L. Lu
Journal of Materials Sciences and Technology, 22 (2006) 789-702.

Hardness and strain rate sensitivity of nanocrystalline Cu
J. Chen, L. Lu, K. Lu
Scripta Materialia, 54 (2006) 1913-1918.

Strain Rate Sensitivity of Ultrafine-grained Cu with Nanosized Twins
L.X. Liu, X. H. Chen, L. Lu
Acta Metallurgica Sinica (English Letters), 19 (2006) 313-318.

High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins
X. Zhang, H. Wang, X. H. Chen, L. Lu, K. Lu, R. G. Hoagland, A. Misra
Applied Physics Letters, 88 (2006) 173116.

Strain rate sensitivity of Cu with nanoscale twins
Y. F. Shen, L. Lu, M. Dao, S. Suresh
Scripta Materialia, 55 (2006) 319-322.

Strength, strain-rate sensitivity and ductility of copper with nanoscale twins
M. Dao, L. Lu, Y. F. Shen, S. Suresh
Acta Materialia, 54 (2006) 5421-5432.

 2005 

孪晶铜中孪晶尺寸对疲劳位错组态的影响
郭小龙, 卢磊, 李守新
金属学报, 41 (2005) 23-27.

Corrosion behaviors of nanocrystalline and conventional polycrystalline copper
J. Yu, E. Han, L. Lu, X. Wei, M. Leung
Journal of Materials Science, 40 (2005) 1019-1022.

Cyclic deformation behavior in pure Cu with growth-in twins
X. L. Guo, L. Lu, S. X. Li
Materials Science and Engineering：A, 405 (2005) 239-245.

Tensile properties of a nanocrystalline 316L austenitic stainless steel
X. H. Chen, J. Lu, L. Lu, K. Lu
Scripta Materialia, 52 (2005) 1039-1044.

Tensile properties of copper with nano-scale twins
Y. F. Shen, L. Lu, Q. H. Lu, Z. H. Jin, K. Lu
Scripta Materialia, 52 (2005) 989-994.

Nano-sized twins induce high rate sensitivity of flow stress in pure copper
L. Lu, R. Schwaiger, Z.W. Shan, M. Dao, K. Lu, S. Suresh
Acta Materialia, 53 (2005) 2169-2179.

Comparison of the Oxidation Behavior of Nanocrystalline and Coarse-Grain Copper
Z. Han, L. Lu, H. W. Zhang, Z. Q. Yang, F. H. Wang, K. Lu
Oxidation of Metals, 63 (2005) 261-275.

Dislocation evolution in twins of cyclically deformed copper
X. L. Guo, L. Lu, S. X. Li
Philosophical Magazine Letters, 85 (2005) 613-623.

 2004 

孪晶对多晶铜疲劳行为的影响
郭小龙, 申勇峰, 卢磊, 李守新
金属学报, 40 (2004) 1281-1284.

Ultrahigh strength and high electrical conductivity in copper
L. Lu, Y. Shen, X. Chen, L. Qian, K. Lu
Science, 304 (2004) 422-426.  Full Text

Strain hardening and large tensile elongation in ultrahigh-strength nano-twinned copper
E. Ma, Y. M. Wang, Q. H. Lu, M. L. Sui, L. Lu, K. Lu
Applied Physics Letters, 85 (2004) 4932-4934.

 2001 

纳米压痕法测量Cu的室温蠕变速率敏感指数
陈吉, 汪伟, 卢磊, 卢柯
金属学报, 37 (2001) 1179-1183.

纳米晶Cu室温冷轧行为研究
卢磊, 隋曼龄, 卢柯
材料导报, 15 (2001) 56-58.

Grain growth and strain release in nanocrystalline copper
L. Lu, N. R. Tao, L. B. Wang, B. Z. Ding, K. Lu
Journal of Applied Physics, 89 (2001) 6408-6414.

Superplasticity Extensibility and Deformation Mechanism of a Nanocrystalline Copper Sample
L. Lu, M. L. Sui, K. Lu
Advanced Engineering Materials, 3 (2001) 663-667.

Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates
D. Jia, K. T. Ramesh, E. Ma, L. Lu, K. Lu
Scripta Materialia, 45 (2001) 613-620.

Cold rolling of bulk nanocrystalline copper
L. Lu, M. L. Sui, K. Lu
Acta Materialia, 49 (2001) 4127-4134.

An abnormal strain rate effect on tensile behavior in nanocrystalline copper
L. Lu, S. X. Li, K. Lu
Scripta Materialia, 45 (2001) 1163-1169.

Creep behavior of cold-rolled nanocrystalline pure copper
B. Cai, Q. P. Kong, P. Cui, L. Lu, K. Lu
Scripta Materialia, 45 (2001) 1407-1413.

The creep of nanocrystalline metals and its connection with grain boundary diffusion
Q. P. Kong, B. Cai, L. Lu, K. Lu
Defect and Diffusion Forum, 188-190 (2001) 45-58.

 2000 

金属纳米材料力学性能的研究进展
卢柯, 卢磊
金属学报, 36 (2000) 785-789.

High-tensile ductility in nanocrystalline copper
L. Lu, L.B. Wang, B.Z. Ding, K. Lu
Journal of Materials Research, 15 (2000) 270-273.

Superplastic Extensibility of Nanocrystalline Copper at Room Temperature
L. Lu, M. L. Sui, K. Lu
Science, 287 (2000) 1463-1466.  Full Text

Low temperature creep of nanocrystalline pure copper
B. Cai, Q. P. Kong, L. Lu, K. Lu
Materials Science and Engineering A, 286 (2000) 188-192.

Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples
L. Lu, L. B. Wang, B. Z. Ding, K. Lu
Materials Science and Engineering A, 286 (2000) 125-129.

 1999 

Interface controlled diffusional creep of nanocrystalline pure copper
B. Cai, Q. P. Kong, L. Lu, K. Lu
Scripta Materialia, 41 (1999) 755-759.